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 1N6508 Isolated Diode Array with HiRel MQ, MX, MV, and MSP Screening Options
SCOTTSDALE DIVISION
DESCRIPTION
These low capacitance diode arrays are multiple, discrete, isolated junctions fabricated by a planar process and mounted in a 14-PIN ceramic DIP package for use as steering diodes protecting up to eight I/O ports from ESD, EFT, or surge by directing them to the positive side of the power supply line and to ground (see Figure 1). An external TVS diode may be added between the positive supply line and ground to prevent overvoltage on the supply rail. They may also be used in fast switching core-driver applications. This includes computers and peripheral equipment such as magnetic cores, thin-film memories, plated-wire memories, etc., as well as decoding or encoding applications. These arrays offer many advantages of integrated circuits such as highdensity packaging and improved reliability. This is a result of fewer pick and place operations, smaller footprint, smaller weight, and elimination of various discrete packages that may not be as user friendly in PC board mounting.
IMPORTANT: For the most current data, consult MICROSEMI's website: http://www.microsemi.com
APPEARANCE
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14-PIN Ceramic DIP
FEATURES
* * * * * * * Hermetic Ceramic Package Isolated Diodes to Eliminate Cross-Talk Voltages High Breakdown Voltage VBR > 60 V at 10 A Low Leakage IR< 100nA at 40 V Low Capacitance C < 8.0 pF Switching Speeds less than 20 ns Options for screening in accordance with MIL-PRF19500/474 for JAN, JANTX, JANTXV, and JANS are available by adding MQ, MX, MV, or MSP prefixes respectively to part numbers. For example, designate MX1N6508 for a JANTX screen. * * * * * * *
APPLICATIONS / BENEFITS
High Frequency Data Lines RS-232 & RS-422 Interface Networks Ethernet: 10 Base T Computer I/O Ports LAN Switching Core Drivers IEC 61000-4 Compatible (see circuit in figure 1) 61000-4-2 ESD: Air 15 kV, contact 8 kW 61000-4-4 (EFT): 40 A - 5/50 ns 61000-4-5 (surge): 12 A 8/20 s
MAXIMUM RATINGS
* * * * * * * Reverse Breakdown Voltage of 60 Vdc (Note 1 & 2) Continuous Forward Current of 300 mA dc (Note 1 & 3) Peak Surge Current (tp=1/120 s) of 500 mA dc (Note 1) o 400 mW Power Dissipation per Junction @ 25 C 600 mW Power Dissipation per Package @ 25oC (Note 4) Operating Junction Temperature range -65 to +150oC o Storage Temperature range of -65 to +200 C
NOTE 1: NOTE 2: NOTE 3: NOTE 4: Each Diode Pulsed: PW = 100 ms max; duty cycle <20% o o Derate at 2.4 mA/ C above +25 C o o Derate at 4.8 mW/ C above +25 C
MECHANICAL AND PACKAGING
* * * * * 14-PIN Ceramic DIP Weight 2.05 grams (approximate) Marking: Logo, part number, date code Pin #1 to the left of the indent on top of package Carrier Tubes; 25 pcs (standard)
ELECTRICAL CHARACTERISTICS (Per Diode) @ 25oC unless otherwise specified
MAXIMUM FORWARD VOLTAGE VF1 IF = 100 mA (Note 1) V MAXIMUM FORWARD VOLTAGE VF2 IF = 500 mA (Note 1) V MAXIMUM REVERSE CURRENT IR1 VR = 40 V A MAXIMUM CAPACITANCE (PIN TO PIN) MAXIMUM FORWARD RECOVERY TIME tfr IF = 500 mA ns MAXIMUM REVERSE RECOVERY TIME trr IF = IR = 200 mA irr = 20 mA RL = 100 ohms ns
1N6508
Ct
VR = 0 V F = 1 MHz pF
PART NUMBER
1N6508
Copyright (c) 2005 6-9-2005 REV B
1
1.7
0.1
8.0
40
20
NOTE 1: Pulsed: PW = 300 us +/- 50 s, duty cycle <2%, 90 s after leading edge.
Microsemi
Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
1N6508 Isolated Diode Array with HiRel MQ, MX, MV, and MSP Screening Options
SCOTTSDALE DIVISION
SYMBOLS & DEFINITIONS
Symbol VBR VF IR Ct DEFINITION Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current. Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and temperature. Capacitance: The capacitance of the TVS as defined @ 0 volts at a frequency of 1 MHz and stated in picofarads.
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SCHEMATIC
PACKAGE DIMENSIONS
CIRCUIT Supply rail (+VCC)
I/O Port
1N6508
GND (or -VCC) Steering Diode Application
FIGURE 1
Copyright (c) 2005 6-9-2005 REV B
Microsemi
Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 2


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